Location:News>>Shows & Events

2016 EDI CON Electronic Design Innovation Conference

Date:2016-01-27    【Size:Big Middle Small




Date:April 19 - 21, 2016
Place:Beijing, China National Convention Center
Organizer:Horizon House Publishing
Booth No.:433


 

Shanghai Shiluan is expected to have a deep exchange with you.

 

EDI CON brings together leading RF, Microwave, high-speed analog and mixed signal components, semicondutor, test and measurement equipment, EMC/EMI and system solution providers in the exhibition. Integrated technical sessions and the conference make the exhibition of the technical conference where attendees can learn first-hand about products and services the offer practical solution to semi-conductor, module, PCB and system design.

 

Three speeches commented by peers in the sessions of technical papers:

• Design
• Measurement and Modeling

Systems Engineering



Invited and submitted papers are reviewed by EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. Additionally, the technical sessions in the morning are organized around track 4 commercial resource focused on sponsored papers.
 

Seminor:

Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and / or measurement equipment.

Opening Talks include: TD-LTE•802.11ac• Carrier Aggregation  NFC  High-speed Digital Convertor • Wireless Communication FPGA RFIC • Front End • SATCOM • Radar System • EMC/EMI
 

Exhibition:

EDI CON brings together leading RF, microwave, high-speed analog and mixed signal compoents, semiconductor, test and measurement eqipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closedly coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.